Power chips are linked to exterior circuits with product packaging, and their efficiency relies on the assistance of the packaging. In high-power circumstances, power chips are generally packaged as power modules. Chip affiliation describes the electric connection on the upper surface of the chip, which is typically light weight aluminum bonding cable in typical components. ^
Traditional power module package cross-section
Presently, commercial silicon carbide power components still mostly make use of the product packaging innovation of this wire-bonded standard silicon IGBT module. They deal with issues such as big high-frequency parasitic specifications, inadequate warm dissipation capability, low-temperature resistance, and inadequate insulation toughness, which restrict making use of silicon carbide semiconductors. The display screen of superb efficiency. In order to resolve these issues and completely manipulate the significant possible advantages of silicon carbide chips, numerous brand-new product packaging technologies and options for silicon carbide power components have emerged in the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually established from gold wire bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold cables to copper wires, and the driving force is cost reduction; high-power tools have actually created from light weight aluminum cords (strips) to Cu Clips, and the driving force is to boost item efficiency. The better the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared with conventional bonding packaging methods, Cu Clip modern technology has the complying with benefits:
1. The link between the chip and the pins is made from copper sheets, which, to a particular extent, changes the standard wire bonding method between the chip and the pins. As a result, an unique plan resistance worth, greater present circulation, and better thermal conductivity can be acquired.
2. The lead pin welding location does not need to be silver-plated, which can totally save the price of silver plating and inadequate silver plating.
3. The item appearance is totally constant with normal items and is mainly utilized in web servers, portable computers, batteries/drives, graphics cards, electric motors, power supplies, and various other fields.
Cu Clip has two bonding methods.
All copper sheet bonding technique
Both the Gate pad and the Source pad are clip-based. This bonding approach is more expensive and intricate, yet it can achieve much better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cord bonding method
The source pad uses a Clip technique, and the Gate uses a Cable technique. This bonding technique is slightly more affordable than the all-copper bonding technique, saving wafer location (relevant to very little gateway areas). The process is less complex than the all-copper bonding technique and can acquire much better Rdson and much better thermal impact.
Vendor of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding tig welding copper, please feel free to contact us and send an inquiry.
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